参数 | NOR Flash Parallel 3V/3.3V 256M-bit 32M x 8/16M x 16 110ns 64-Pin Fortified BGA T/R |
手册 | S29GL256P11FFIV23 数据表 |
单价 | ¥50.2100(含税) |
梯价 |
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信息更新于:2022-09-07 03:03
欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | 3A991.b.1.a |
Part Status | Active |
HTS | 8542.32.00.51 |
Cell Type | NOR |
Chip Density (bit) | 256M |
Architecture | Sectored |
Boot Block | No |
Block Organization | Symmetrical |
Address Bus Width (bit) | 25/24 |
Sector Size | 128Kbyte x 256 |
Page Size | 8Words/16byte |
Number of Bits/Word (bit) | 8/16 |
Number of Words | 32M/16M |
Programmability | Yes |
Timing Type | Asynchronous |
Max. Access Time (ns) | 110 |
Maximum Erase Time (s) | 512/Chip |
Maximum Page Access Time (ns) | 25 |
Maximum Programming Time (ms) | 246000(Typ)/Chip |
OE Access Time (ns) | 25 |
Process Technology | 90nm, MirrorBit |
Interface Type | Parallel |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Programming Voltage (V) | 2.7 to 3.6|11.5 to 12.5 |
Operating Current (mA) | 110 |
Page Read Current (mA) | 20 |
Program Current (mA) | 90 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Command Compatible | Yes |
ECC Support | No |
Support of Page Mode | Yes |
Minimum Endurance (Cycles) | 100000(Typ) |
Packaging | Tape and Reel |
Standard Package Name | BGA |
Pin Count | 64 |
Supplier Package | Fortified BGA |
Mounting | Surface Mount |
Package Height | 0.6(Min) |
Package Length | 13 |
Package Width | 11 |
PCB changed | 64 |
Lead Shape | Ball |