1/5
W631GU6MB12I/TRAY
- 型号
- W631GU6MB12I/TRAY
- 品牌
- Winbond Electronics
| 参数 | DRAM Chip DDR3L SDRAM 1Gbit 64Mx16 1.35V 96-Pin VFBGA |
| 手册 | W631GU6MB12I/TRAY 数据表 |
| 批次 | + |
| 单价 | ￥29.4200（含税） |
| 梯价 |
|
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商品详情
信息更新于：2022-09-07 03:09
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.32 |
| DRAM Type | DDR3L SDRAM |
| Chip Density (bit) | 1G |
| Organization | 64Mx16 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 8M |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 1600 |
| Address Bus Width (bit) | 16 |
| Minimum Operating Supply Voltage (V) | 1.283 |
| Typical Operating Supply Voltage (V) | 1.35 |
| Maximum Operating Supply Voltage (V) | 1.45 |
| Operating Current (mA) | 190 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Industrial |
| Number of I/O Lines (bit) | 16 |
| Standard Package Name | BGA |
| Pin Count | 96 |
| Supplier Package | VFBGA |
| Mounting | Surface Mount |
| Package Height | 0.6(Max) |
| Package Length | 13 |
| Package Width | 7.5 |
| PCB changed | 96 |
| Lead Shape | Ball |
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